PACK EXPO International attendees reunited in Chicago for the first time since 2018.

The EDI Prodigi die system, a more responsive APC (automatic profile control) die for cast film, sheet and extrusion coating applications. 

With its DIGILINE Vario, Atlantic Zeiser presents for the first time a system for full-color inline printing of flexible narrow web materials such as foils for lidding applications or flexible laminates for pouching or tube converting applications.

New infrastructure increases capacity by 20%, enhances efficiencies, shortens lead times and improves overall quality for prominent paperboard packaging provider. 

ULMA continues expansion of ULMAweCare sustainable solutions.

Attendees who visit booth #10200 will learn about Sun Chemical’s approach to sustainable solutions, which include bio-renewable, compostable, and recyclable products under the SunEco portfolio of solutions.

The event is designed for new hires and newcomers to the flexible packaging industry with fewer than five years of industry experience. 

This year’s honorees are Jean-Jacques Graffin, Rebecca Oesterle, Pierre Pienaar, and E. Jeffrey Rhodehamel.

From bagging equipment to robotic palletizing, the latest innovation in packaging equipment is debuted at PACK EXPO International. Here are just a few of the new machinery advances being demonstrated in Chicago.

PMMI, the producer of PACK EXPO International, welcomes the packaging and processing industries back to Chicago’s McCormick Place after four years.