According to a recent study from market research firm Global Market Insights, the advanced packaging market is set to grow from its current market value of more than $25 billion to over $40 billion by 2026, gaining remarkable traction over the 2020 to 2026 period.

The advanced packaging market is poised to accumulate noteworthy gains in coming years owing to high product adoption across numerous application avenues such as healthcare, automotive, consumer electronics, aerospace & defense among others. Advanced packaging was developed to improve the performance of device and simultaneously shrink the packages. It is termed as a general grouping of a variety of different techniques such as system-in-package, 3D-IC, 2.5D, and fan-out wafer-level packaging.